DocumentCode
3460663
Title
NBTI-channel hot carrier effects in PMOSFETs in advanced CMOS technologies
Author
Rosa, G. La ; Guarin, F. ; Rauch, S. ; Acovic, A. ; Lukaitis, J. ; Crabbe, E.
Author_Institution
Semicond. Res. & Dev. Center, IBM Corp., Hopewell Junction, NY, USA
fYear
1997
fDate
8-10 Apr 1997
Firstpage
282
Lastpage
286
Abstract
In this work the reliability of a 0.35 μm p+ poly-gate pMOSFET CMOS technology under conductive channel hot carrier conditions is investigated. It is found that at any bias and temperature condition applied, the degradation of sufficiently short channel length (Leff≃0.14 um) devices results in a reduction in drive current due to the impact of donor type interface trap generation and positive charge formation during the stress. At these dimensions the degradation is controlled by a contribution of both Negative Bias Temperature Instability (NBTI) and Channel Hot Carrier (CHC) mechanism. We will show the role that each of these two mechanisms play in determining the shift of typical device parameters. A methodology to decouple the two effects is also provided allowing to quantify each contribution separately at any bias and temperature condition. A conductive CHC model that takes into account the impact of both mechanisms to the device lifetime at the worst observed degradation condition (Vg=Vd) is also discussed
Keywords
CMOS integrated circuits; MOSFET; carrier mobility; electron traps; hole traps; hot carriers; integrated circuit reliability; integrated circuit technology; interface states; semiconductor device reliability; 0.14 micron; 0.35 micron; 80 C; NBTI-channel hot carrier effects; advanced CMOS technologies; conductive channel hot carrier conditions; donor type interface trap generation; hot hole injection; maximum transconductance; mobility degradation; negative bias temperature instability; p+ poly-gate pMOSFET CMOS technology; p-MOSFETs; p-channel MOSFET; positive charge formation; reliability; short channel length; submicron technology; threshold voltage; CMOS technology; Degradation; Hot carrier effects; Hot carriers; MOSFETs; Negative bias temperature instability; Niobium compounds; Stress; Temperature control; Titanium compounds;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1997. 35th Annual Proceedings., IEEE International
Conference_Location
Denver, CO
Print_ISBN
0-7803-3575-9
Type
conf
DOI
10.1109/RELPHY.1997.584274
Filename
584274
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