Title :
Novel TPMS sensing chip with pressure sensor embedded in accelerometer
Author :
Yeh, W.-C. ; Chan, C.-K. ; Hsieh, Jen-Wei ; Hu, C.-F. ; Hsu, F.-M. ; Fang, Wanliang
Author_Institution :
Asia Pacific Microsyst., Inc., Hsinchu, Taiwan
Abstract :
This study reports the design architecture to embed piezoresistive pressure sensor into accelerometer (PinG sensor) on a single chip by using the cavity-SOI process. The monolithic sensing chip can find various applications such as tire pressure monitoring system (TPMS), etc. The merits of the presented design includes significant chip size reduction by integrating the diaphragm of pressure sensor into the proof-mass of accelerometer, as well as better manufacturability through combining piezoresistor (PZR) process and CSOI process. Preliminary tests demonstrated the feasibility of detecting both pressure and acceleration using the presented PinG sensor. This design architecture is also applicable for other sensors integration.
Keywords :
CMOS integrated circuits; accelerometers; automotive electronics; condition monitoring; diaphragms; monolithic integrated circuits; piezoresistive devices; pressure sensors; silicon-on-insulator; tyres; CSOI process; PZR process; PinG sensor; TPMS sensing chip; acceleration detection; accelerometer; cavity-SOI process; chip size reduction; diaphragm; monolithic sensing chip; piezoresistive pressure sensor integration; pressure detection; proof mass; tire pressure monitoring system; Acceleration; Accelerometers; Glass; Piezoresistance; Routing; Sensors; Voltage measurement; TPMS; accelerometer; combo sensor; monolithic integration; piezoresistive pressure sensor;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on
Conference_Location :
Barcelona
DOI :
10.1109/Transducers.2013.6627128