Title :
Relaxation behavior of ultrasonic attenuation in YBa2Cu 3O7
Author :
Sun, K.J. ; Xu, M.F. ; Sarma, Bimal K. ; Levy, M.
Author_Institution :
Dept. of Phys., Coll. of William & Mary, Williamsburg, VA, USA
Abstract :
Temperature-dependent ultrasonic attenuation measurements have been performed on a pressed powder sample of YBa2Cu3 O7 with frequencies at 10, 27, and 32 MHz. An attenuation anomaly occurs at temperature close to the superconducting transition temperature Tc (90 K) for each frequency. It is also found that the magnitudes of these attenuation peaks are of quadratic frequency dependence. With normalized attenuation data and by employing the Debye equation for relaxation type ultrasonic attenuation, the relaxation time is found to be exponentially dependent on temperature. Moreover, the velocity of a 10 MHz sound wave propagating in the sample generally increases with decreasing temperature while exhibiting a possible softening around Tc. These variations of attenuation and velocity at temperatures near T c may be associated with the structural distortion of YBa2Cu3O7 and may indirectly be a result of superconducting transition
Keywords :
attenuation measurement; barium compounds; high-temperature superconductors; superconducting transition temperature; ultrasonic absorption; ultrasonic measurement; ultrasonic relaxation; ultrasonic velocity; yttrium compounds; 10 MHz; 27 MHz; 32 MHz; 90 K; Debye equation; YBa2Cu3O7; high temperature superconductors; normalized attenuation data; pressed powder sample; quadratic frequency dependence; relaxation time; sound wave propagation velocity; structural distortion; superconducting transition temperature; temperature dependence; ultrasonic attenuation measurements; Attenuation measurement; Electrical resistance measurement; Frequency dependence; Frequency measurement; High temperature superconductors; Powders; Superconducting magnets; Temperature dependence; Temperature distribution; Ultrasonic transducers;
Conference_Titel :
Ultrasonics Symposium, 1988. Proceedings., IEEE 1988
Conference_Location :
Chicago, IL
DOI :
10.1109/ULTSYM.1988.49546