Wafer level sandwich packaging technology for three-axis piezoresistive accelerometer

Author

Aono, T. ; Kazama, A. ; Okada, Ryutaro ; Hata, Satoshi ; Sakamoto, E.

Author_Institution

Hitachi Res. Lab., Hitachi, Ltd., Hitachi, Japan

fYear

2013

fDate

16-20 June 2013

Firstpage

1966

Lastpage

1969

Abstract

A technology for packaging a three-axis piezo-resistive accelerometer, namely, “wafer level sandwich packaging” was developed. This technology consists of three key processes: first, concurrent bonding of three stacked wafers; second, eutectic bonding using Au-Sn alloyed metal; and third, a top cap separation by polishing. It was used to fabricate the smallest dies for a piezoresistive accelerometer, namely, 1.18 mm wide, 1.32 mm long and 0.6 mm high, reported to date.

Keywords

accelerometers; gold alloys; microsensors; piezoresistive devices; polishing; tin alloys; wafer bonding; wafer level packaging; MEMS devices; concurrent stacked wafer bonding; dies fabrication; eutectic bonding; piezoresistive accelerometer; polishing; size 0.6 mm; size 1.32 mm; size 1.8 mm; top cap separation; wafer level sandwich packaging technology; Accelerometers; Bonding; Gold; Nickel; Piezoresistance; Substrates; Au-Sn alloyed metal; Wafer level package; air damping; eutectic bonding; piezoresistive accelerometer;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on

Conference_Location

Barcelona

Type

conf

DOI

10.1109/Transducers.2013.6627180

Filename

6627180