Title :
Micro-relay reliability improvement by inkjet-printed microshell encapsulation
Author :
Yenhao Chen ; Eung Seok Park ; I-Ru Chen ; Hutin, Louis ; Subramanian, Venkatachalam ; Liu, T.-J King
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Univ. of California, Berkeley, Berkeley, CA, USA
Abstract :
A low-thermal-budget nanoparticle inkjet-printed microshell encapsulation technology is successfully applied to a micro-electro-mechanical (MEM) relay, and is demonstrated to mitigate the issue of contact oxidation. Specifically, the stability of the relay ON-state resistance is dramatically improved by more than a factor of 100.
Keywords :
CMOS integrated circuits; encapsulation; ink jet printing; integrated circuit packaging; integrated circuit reliability; microrelays; nanoparticles; oxidation; CMOS-compatible packaging technology; contact oxidation; microelectro-mechanical relay; microrelay reliability; nanoparticle inkjet-printed microshell encapsulation technology; relay ON-state resistance; Electrodes; Encapsulation; Gold; Logic gates; Materials; Relays; Inkjet-printing; MEM relay; contact stability; microshell encapsulation; packaging; reliability;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on
Conference_Location :
Barcelona
DOI :
10.1109/Transducers.2013.6627182
