DocumentCode
3461771
Title
The era of silicon MEMS microphone and look beyond
Author
Zhe Wang ; Quanbo Zou ; Qinglin Song ; Jifang Tao
Author_Institution
GoerTek Inc., Weifang, China
fYear
2015
fDate
21-25 June 2015
Firstpage
375
Lastpage
378
Abstract
After having been long incubated originally for miniature hearing aid application, silicon condenser microphone found its adoption in mobile phone applications 12 years ago and has since then explosively grown to one of the most pursued products in the MEMS industry. Development of silicon MEMS microphone looks simple but has many intrinsically hidden issues and challenges to overcome and solve. Lessons and experience from both failed and successful developments will be shared. Future outlook of its application roadmap will be envisioned. As being driven by fast paced mobile phones and smart devices, silicon MEMS microphone may soon encounter its technical boundary and restraints. Potential disruptive solutions for sustaining growth will be discussed in this talk.
Keywords
micromechanical devices; microphones; MEMS microphone; miniature hearing aid application; silicon condenser microphone; technical boundary; Application specific integrated circuits; Micromechanical devices; Microphones; Patents; Reliability; Signal to noise ratio; Silicon; Silicon MEMS microphone; chip structural design; packaging; prospective technologies;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers - 2015 18th International Conference on
Conference_Location
Anchorage, AK
Type
conf
DOI
10.1109/TRANSDUCERS.2015.7180939
Filename
7180939
Link To Document