• DocumentCode
    3461771
  • Title

    The era of silicon MEMS microphone and look beyond

  • Author

    Zhe Wang ; Quanbo Zou ; Qinglin Song ; Jifang Tao

  • Author_Institution
    GoerTek Inc., Weifang, China
  • fYear
    2015
  • fDate
    21-25 June 2015
  • Firstpage
    375
  • Lastpage
    378
  • Abstract
    After having been long incubated originally for miniature hearing aid application, silicon condenser microphone found its adoption in mobile phone applications 12 years ago and has since then explosively grown to one of the most pursued products in the MEMS industry. Development of silicon MEMS microphone looks simple but has many intrinsically hidden issues and challenges to overcome and solve. Lessons and experience from both failed and successful developments will be shared. Future outlook of its application roadmap will be envisioned. As being driven by fast paced mobile phones and smart devices, silicon MEMS microphone may soon encounter its technical boundary and restraints. Potential disruptive solutions for sustaining growth will be discussed in this talk.
  • Keywords
    micromechanical devices; microphones; MEMS microphone; miniature hearing aid application; silicon condenser microphone; technical boundary; Application specific integrated circuits; Micromechanical devices; Microphones; Patents; Reliability; Signal to noise ratio; Silicon; Silicon MEMS microphone; chip structural design; packaging; prospective technologies;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers - 2015 18th International Conference on
  • Conference_Location
    Anchorage, AK
  • Type

    conf

  • DOI
    10.1109/TRANSDUCERS.2015.7180939
  • Filename
    7180939