Title :
White light interferometry for 3D inspection
Author_Institution :
Electronics Packaging Laboratory, Dresden University of Technology, 01062 Dresden, Germany
Abstract :
For inspection of advanced packages in the assembling process of electronics manufacturing precise and fast 3D measurement methods desired. White light interferomety is a measuring method to acquire the shape of 3D surfaces very accurately. Aspects of the realization and the practical use of this measuring method are discussed. Parameters of the interferometer have been aligned at a electronic package.
Keywords :
Assembly; Electronics packaging; Inspection; Interference; Manufacturing processes; Mirrors; Optical interferometry; Optical scattering; Optical sensors; Shape measurement;
Conference_Titel :
Photonics and Microsystems, 2004. Proceedings of 2004 International Students and Young Scientists workshop
Conference_Location :
Acapulco, Mexico
Print_ISBN :
0-7803-8598-5
DOI :
10.1109/STYSW.2004.1459937
