DocumentCode :
3462564
Title :
Implementation of a Third-Generation 16-Core 32-Thread Chip-Multithreading SPARCs® Processor
Author :
Konstadinidis, Georgios ; Rashid, Mamun ; Lai, Peter F. ; Otaguro, Yukio ; Orginos, Yannis ; Parampalli, Sudhendra ; Steigerwald, Mark ; Gundala, Shriram ; Pyapali, Rambabu ; Rarick, Leonard ; Elkin, Ilyas ; Ge, Yuefei ; Parulkar, Ishwar
Author_Institution :
Sun Microsyst., Santa Clara, CA
fYear :
2008
fDate :
3-7 Feb. 2008
Firstpage :
84
Lastpage :
597
Abstract :
This third-generation chip-multithreading (CMT) SPARC processor is targeted for high-performance servers, and is optimized for both single- and multi-threaded applications. The architecture highlights are provided in [M. Tremblay and S. Chaudhry, 2008], while this paper focuses on the physical implementation aspects, providing an overview of circuit innovations in memory arrays, register files, and floating-point hardware that boost the performance and circuit robustness with low area overhead. The 396mm2 chip is fabricated in a 11M 65nm CMOS process and operates at a nominal frequency of 2.3GHz, consuming a maximum power of 250W at 1.2V. Power-management techniques include clock gating at core-cluster level and power throttling through a single-thread-issue mode of operation. This mode is used in power-constrained systems without sacrificing single-thread performance.
Keywords :
microprocessor chips; multi-threading; 16-core 32-thread chip-multithreading SPARC processor; CMOS process; circuit robustness; complementary metal-oxide-semiconductor; floating point hardware; frequency 2.3 GHz; high performance server; memory array; power 250 W; power constrained system; power management technique; register file; size 65 nm; third-generation chip-multithreading SPARC processor; voltage 1.2 V; Circuit faults; Clocks; Delay; Logic arrays; Random access memory; Registers; Testing; Throughput; Timing; Yarn;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference, 2008. ISSCC 2008. Digest of Technical Papers. IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4244-2010-0
Electronic_ISBN :
978-1-4244-2011-7
Type :
conf
DOI :
10.1109/ISSCC.2008.4523068
Filename :
4523068
Link To Document :
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