DocumentCode
3462983
Title
Enhanced boiling heat transfer with copper oxide hierarchical surfaces
Author
Chu, K.-H. ; Zhu, Yujia ; Miljkovic, N. ; Nam, Y. ; Enright, Ryan ; Wang, E.N.
Author_Institution
Massachusetts Inst. of Technol., Cambridge, MA, USA
fYear
2013
fDate
16-20 June 2013
Firstpage
2272
Lastpage
2275
Abstract
We experimentally investigated the enhancement in critical heat flux (CHF) during pool boiling on copper oxide (CuO) hierarchical surfaces, where surface roughness at multiple length scales is presented. On the surface with the highest surface roughness factor of 13.3, a CHF of ≈250 W/cm2 and heat transfer coefficient of ≈8×104 W/m2 K, were achieved. A good agreement between our developed model and experimental results supports the idea that roughness-amplified surface forces are responsible for CHF enhancement on structured surfaces. The work promises enhanced heat removal capability using hierarchically-structured surfaces for high heat flux thermal management.
Keywords
copper compounds; heat transfer; surface roughness; thermal management (packaging); CuO; copper oxide hierarchical surfaces; critical heat flux enhancement; heat flux thermal management; heat removal capability; heat transfer coefficient; pool boiling; roughness-amplified surface forces; surface roughness factor; Copper; Heat transfer; Heating; Rough surfaces; Silicon; Surface roughness; Surface treatment; boiling; copper oxide; critical heat flux; hierarchical surface; nanostructure; surface roughness;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on
Conference_Location
Barcelona
Type
conf
DOI
10.1109/Transducers.2013.6627258
Filename
6627258
Link To Document