• DocumentCode
    3462983
  • Title

    Enhanced boiling heat transfer with copper oxide hierarchical surfaces

  • Author

    Chu, K.-H. ; Zhu, Yujia ; Miljkovic, N. ; Nam, Y. ; Enright, Ryan ; Wang, E.N.

  • Author_Institution
    Massachusetts Inst. of Technol., Cambridge, MA, USA
  • fYear
    2013
  • fDate
    16-20 June 2013
  • Firstpage
    2272
  • Lastpage
    2275
  • Abstract
    We experimentally investigated the enhancement in critical heat flux (CHF) during pool boiling on copper oxide (CuO) hierarchical surfaces, where surface roughness at multiple length scales is presented. On the surface with the highest surface roughness factor of 13.3, a CHF of ≈250 W/cm2 and heat transfer coefficient of ≈8×104 W/m2 K, were achieved. A good agreement between our developed model and experimental results supports the idea that roughness-amplified surface forces are responsible for CHF enhancement on structured surfaces. The work promises enhanced heat removal capability using hierarchically-structured surfaces for high heat flux thermal management.
  • Keywords
    copper compounds; heat transfer; surface roughness; thermal management (packaging); CuO; copper oxide hierarchical surfaces; critical heat flux enhancement; heat flux thermal management; heat removal capability; heat transfer coefficient; pool boiling; roughness-amplified surface forces; surface roughness factor; Copper; Heat transfer; Heating; Rough surfaces; Silicon; Surface roughness; Surface treatment; boiling; copper oxide; critical heat flux; hierarchical surface; nanostructure; surface roughness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on
  • Conference_Location
    Barcelona
  • Type

    conf

  • DOI
    10.1109/Transducers.2013.6627258
  • Filename
    6627258