DocumentCode :
3463304
Title :
Ballasting resistor optimum for the self-heating effect compensation in RF power HBTs
Author :
Dong-Yue, Jin ; Wan-Rong, Zhang ; Jian-Jun, Qiu ; Pan, Gao
Author_Institution :
Coll. of Electron. Inf. & Control Eng., Beijing Univ. of Technol.
fYear :
2006
fDate :
23-26 Oct. 2006
Firstpage :
224
Lastpage :
226
Abstract :
Base on the thermal-electric feedback network analysis, the thermal stability factor S is presented to express the thermal stability of the device. It is shown that the self-heating effect is compensated completely and the electrical characteristic of device won´t shift when S=0. Furthermore, the expression of the minimum ballasting resistance R c of HBT to compensate the self-heating effect is presented taking into account of the temperature dependence of emitter current, the valence-band discontinuity at emitter junction (DeltaEV), the bandgap narrowing due to heavy doping (DeltaEg), additional ballasting resistance in emitter and base (RB and RE). It is found that the higher the temperature T is, the smaller the minimum ballasting resistance RC to compensate the self-heating effect is. The agreement between theory and experiment is shown to be excellent. Because of the reducing of ballasting resistance, RF power HBT will provide higher output power, power gain, and power-added efficiency (PAE) in an amplifier block
Keywords :
amplifiers; heterojunction bipolar transistors; network analysis; power bipolar transistors; thermal stability; ballasting resistance; ballasting resistor optimum; emitter junction; network analysis; radiofrequency power HBT; self-heating effect compensation; thermal stability factor; thermal-electric feedback; Electric resistance; Electric variables; Electronic ballasts; Feedback; Heterojunction bipolar transistors; Radio frequency; Resistors; Stability analysis; Thermal factors; Thermal stability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0160-7
Electronic_ISBN :
1-4244-0161-5
Type :
conf
DOI :
10.1109/ICSICT.2006.306168
Filename :
4098068
Link To Document :
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