DocumentCode :
3463325
Title :
A Fingerprint Sensor with Impedance Sensing for Fraud Detection
Author :
Shimamura, Toshishige ; Morimura, Hiroki ; Shimoyama, Nobuhiro ; Sakata, Tomomi ; Shigematsu, Satoshi ; Machida, Katsuyuki ; Nakanishi, Mamoru
Author_Institution :
NTT Microsyst. Integration Labs., Atsugi
fYear :
2008
fDate :
3-7 Feb. 2008
Firstpage :
170
Lastpage :
604
Abstract :
A fingerprint sensor that integrates fraud detection and fingerprint sensing to prevent spoofing with a fake (artificial) finger is presented. Fingerprint identification using capacitive fingerprint sensing provides small user-authentication systems. For systems that need a higher level of security, fraud detection, which determines whether the sensed finger is alive or not, is necessary. Integrating fraud detection capability into a capacitive sensor is important because attempted fraud has to be detected at the same time that the fingerprint is captured. Various methods that use information about a finger, such as its electrical characteristics, optical characteristics or elastic characteristics, have been tried. Impedance-sensing is suitable from the viewpoint of using electrical signals. An impedance-sensing circuit should not increase the chip size nor degrade the quality of the captured fingerprint image. To meet these requirements, we propose an impedance-sensing scheme built into a capacitive sensor and implemented as a circuit and electrode without changing the chip size.
Keywords :
capacitive sensors; electric impedance measurement; fingerprint identification; fraud; image sensors; artificial finger; capacitive fingerprint sensing; capacitive sensor; elastic characteristics; electrical characteristics; electrical signals; fingerprint identification; fingerprint sensor; impedance sensing; integrating fraud detection; optical characteristics; user-authentication systems; Capacitive sensors; Circuits; Degradation; Electric variables; Fingerprint recognition; Fingers; Image matching; Impedance; Information security; Optical sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference, 2008. ISSCC 2008. Digest of Technical Papers. IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4244-2010-0
Electronic_ISBN :
978-1-4244-2011-7
Type :
conf
DOI :
10.1109/ISSCC.2008.4523111
Filename :
4523111
Link To Document :
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