Photonic thermocouple design based on an ultra-compact michelson interferometer

Author

Tao, J.F. ; Cai, H. ; Zhang, Q.X. ; Tsai, Julius Minglin ; Kropelnicki, Piotr ; Randles, A.B. ; Tang, M. ; Liu, A.Q.

Author_Institution

Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore

fYear

2013

fDate

16-20 June 2013

Firstpage

2365

Lastpage

2368

Abstract

This paper reports a photonic thermocouple based on an ultra-compact Michelson Interferometer (MI) for on-chip temperature sensing. All components are fabricated by using standard CMOS process. Compared with the traditional temperature sensors based on electronics, this proposed photonics thermocouple has more compact size (40 μm × 70 μm), high sensitivity (113.72 pm/K), cost-effective, and immunity to the electromagnetic interference. The proposed photonic thermocouple has potential applications in harsh environments, such as nuclear power plants and oil-drills.

Keywords

CMOS integrated circuits; Michelson interferometers; electromagnetic interference; integrated circuit design; integrated circuit packaging; integrated optoelectronics; light interference; optical fabrication; optical sensors; temperature sensors; thermocouples; MI; electromagnetic interference; nuclear power plant; oil-drill; on-chip temperature sensor; photonic thermocouple design; standard CMOS process; ultracompact Michelson interferometer; Optical fiber sensors; Optical fibers; Optical reflection; Temperature sensors; NEMS; Photonic thermocouple; integrated optics sensor; on-chip temperature sensing;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on

Conference_Location

Barcelona

Type

conf

DOI

10.1109/Transducers.2013.6627281

Filename

6627281