Title :
Integration of a SiP for GSM/EDGE in CMOS Technology
Author :
Puma, Giuseppe Li ; Kristan, Ernst ; De Nicola, Paolo ; Vannier, Cyril ; Greyling, Braam ; Piccolella, Salvatore
Author_Institution :
Infineon Technol., Duisburg
Abstract :
In this paper, a system-in-package (SiP) integration solution for GSM/EDGE consisting of two monolithic integrated dies is presented. The first die includes the BB and RF transceiver blocks and is fabricated in a standard 6M 0.13 mum CMOS technology with MIM capacitors. The second die includes the PMU and an audio power amplifier and is implemented in a 0.25 mum CMOS technology. Both dies are flip-chipped side-by-side into a 10x10 mm2 very thin BGA-293 package with a dual metal layer substrate for routing.
Keywords :
3G mobile communication; CMOS integrated circuits; ball grid arrays; cellular radio; flip-chip devices; system-in-package; BGA-293 package; CMOS technology; GSM-EDGE; MIM capacitor; SiP; flip-chip package; monolithic integrated die; size 0.13 mum; size 0.25 mum; system-in-package; CMOS technology; GSM; MIM capacitors; Packaging; Phasor measurement units; Power amplifiers; Radio frequency; Radiofrequency amplifiers; Routing; Transceivers;
Conference_Titel :
Solid-State Circuits Conference, 2008. ISSCC 2008. Digest of Technical Papers. IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4244-2010-0
Electronic_ISBN :
978-1-4244-2011-7
DOI :
10.1109/ISSCC.2008.4523131
