• DocumentCode
    3464003
  • Title

    Interaction effects of temperature and stress on matched-mode gyroscope frequencies

  • Author

    Tatar, E. ; Guo, Chuangxin ; Mukherjee, Tridib ; Fedder, Gary K.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
  • fYear
    2013
  • fDate
    16-20 June 2013
  • Firstpage
    2527
  • Lastpage
    2530
  • Abstract
    We present our initial results toward understanding the interaction of temperature and stress on resonant frequencies of a matched-mode SOI-MEMS gyroscope. We also validate a new electrostatic frequency tuning design for gyroscopes that works over large displacements. A stress and temperature gradient is formed on the gyroscope die by using on-chip silicon heaters, affecting the gyroscope frequencies. Simulation and measurements of the gyroscope frequencies under different gradient conditions are compared. We also show that the orientation of the die with respect to an asymmetric package plays an important role in frequency response of the gyroscope to environmental conditions.
  • Keywords
    electrostatic devices; frequency response; gyroscopes; micromechanical resonators; microsensors; mode matching; semiconductor device packaging; silicon; silicon-on-insulator; Si; asymmetric package; electrostatic frequency tuning design; environmental condition; frequency response; gyroscope die; gyroscope frequency measurement; matched mode SOI-MEMS gyroscope; matched mode gyroscope frequency; on-chip silicon heater; resonant frequency; stress gradient; stress interaction effect; temperature gradient; temperature interaction effect; Gyroscopes; Heating; Resonant frequency; Stress; Temperature measurement; Temperature sensors; Tuning; Young´s Modulus; frequency tuning; gyroscope; matched-mode; shaped combs; stress and temperature effects;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on
  • Conference_Location
    Barcelona
  • Type

    conf

  • DOI
    10.1109/Transducers.2013.6627320
  • Filename
    6627320