• DocumentCode
    3464037
  • Title

    Defect passivation and interface engineering for high-K gate dielectric device performance and reliability enhancement

  • Author

    Tseng, Hsing-Huang

  • Author_Institution
    Front End Processes Div., SEMATECH, Austin, TX
  • fYear
    2006
  • fDate
    Oct. 2006
  • Firstpage
    364
  • Lastpage
    367
  • Abstract
    Using a fluorinated high-k/metal gate stack combined with a stress relieved pre-oxide (SRPO) pretreatment before high-k deposition, the authors show significant device reliability and performance improvements. This is a critical result since threshold voltage instability may be a fundamental problem and performance degradation for high-k is a concern. The novel fluorinated gate stack device exceeds the PBTI and NBTI targets with sufficient margin and has electron mobility comparable to the best polySi/SiON device on bulk Si reported so far
  • Keywords
    CMOS integrated circuits; dielectric materials; electron mobility; integrated circuit reliability; interface states; passivation; silicon; silicon compounds; SiON; defect passivation; electron mobility; high-k gate dielectric device; interface engineering; performance degradation; reliability enhancement; stress relieved pre-oxide pretreatment; threshold voltage instability; Degradation; Electron mobility; High K dielectric materials; High-K gate dielectrics; Niobium compounds; Passivation; Reliability engineering; Stress; Threshold voltage; Titanium compounds;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    1-4244-0160-7
  • Electronic_ISBN
    1-4244-0161-5
  • Type

    conf

  • DOI
    10.1109/ICSICT.2006.306253
  • Filename
    4098110