DocumentCode
3464037
Title
Defect passivation and interface engineering for high-K gate dielectric device performance and reliability enhancement
Author
Tseng, Hsing-Huang
Author_Institution
Front End Processes Div., SEMATECH, Austin, TX
fYear
2006
fDate
Oct. 2006
Firstpage
364
Lastpage
367
Abstract
Using a fluorinated high-k/metal gate stack combined with a stress relieved pre-oxide (SRPO) pretreatment before high-k deposition, the authors show significant device reliability and performance improvements. This is a critical result since threshold voltage instability may be a fundamental problem and performance degradation for high-k is a concern. The novel fluorinated gate stack device exceeds the PBTI and NBTI targets with sufficient margin and has electron mobility comparable to the best polySi/SiON device on bulk Si reported so far
Keywords
CMOS integrated circuits; dielectric materials; electron mobility; integrated circuit reliability; interface states; passivation; silicon; silicon compounds; SiON; defect passivation; electron mobility; high-k gate dielectric device; interface engineering; performance degradation; reliability enhancement; stress relieved pre-oxide pretreatment; threshold voltage instability; Degradation; Electron mobility; High K dielectric materials; High-K gate dielectrics; Niobium compounds; Passivation; Reliability engineering; Stress; Threshold voltage; Titanium compounds;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
Conference_Location
Shanghai
Print_ISBN
1-4244-0160-7
Electronic_ISBN
1-4244-0161-5
Type
conf
DOI
10.1109/ICSICT.2006.306253
Filename
4098110
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