DocumentCode :
3464134
Title :
Role of oxygen states in high-K gate stack engineering
Author :
Takeuchi, Hideki ; Shiraishi, Kenji ; Liu, Tsu-Jae King
Author_Institution :
ATDF Inc., Austin, TX
fYear :
2006
fDate :
23-26 Oct. 2006
Firstpage :
388
Lastpage :
391
Abstract :
Fundamental properties of SiO2 and high-k dielectrics are compared, and the differences can be used to explain physical phenomena in high-k gate stacks. Interfacial reactions and gate Fermi-level pinning arise from the ionic nature of oxygen states in high-k dielectrics. Film crystallization is actually preferable for high-k gate dielectrics due to their lack of bond flexibility, while phase separation in silicates must be avoided because it leads to severe degradation of film properties
Keywords :
Fermi level; crystallisation; defect states; dielectric materials; interface states; silicon compounds; Fermi-level pinning; SiO2; bond flexibility; defect states; film crystallization; high-k dielectrics; high-k gate stacks; interfacial reactions; Bonding; Crystallization; Electrons; Hafnium; High K dielectric materials; High-K gate dielectrics; Inorganic materials; Leakage current; Oxidation; Oxygen;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0160-7
Electronic_ISBN :
1-4244-0161-5
Type :
conf
DOI :
10.1109/ICSICT.2006.306259
Filename :
4098116
Link To Document :
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