• DocumentCode
    3464233
  • Title

    Combinatorial materials exploration and composition tuning for the future gate stack structure

  • Author

    Chikyow, Toyohiro ; Hasegawa, Ken ; Tamori, Tae ; Ohmori, Kenji ; Umezawa, Naoto ; Nakajima, Kiyomi ; Yamada, Keisaku ; Koinuma, Hideomi

  • Author_Institution
    National Inst. for Mater. Sci., Tsukuba
  • fYear
    2006
  • fDate
    23-26 Oct. 2006
  • Firstpage
    412
  • Lastpage
    417
  • Abstract
    A combinatorial ternary composition spread method, which included continuous ternary and binary compositions, was applied for new materials exploration for the future gate stack structure, rapid estimation of permittivity are carried out by microwave microscope as well as conventional C-V measurement. Structural analyses are performed systematically by combinatorial X-ray diffraction equipment. Higher dielectric region are observed in (HfO2)x(Y2 O3)y(Al2O3)z and ternary composition area. Al2O3 was found to have an ability that prevents HfO2-Y2O 3 alloy from crystallization. the authors found that HfxYxAlzO ternary oxide is a candidate of stable amorphous high-k gate dielectric material with stable interface on Si substrate. The reason of this stability could be explained by charge neutrality based on the phase diagram which is concluded by thermodynamics
  • Keywords
    X-ray diffraction; aluminium; amorphous state; crystallisation; dielectric materials; hafnium compounds; permittivity; silicon; yttrium compounds; HfO2-Y2O3-Al2O3 ; X-ray diffraction; amorphous high-k gate dielectric material; combinatorial materials exploration; combinatorial ternary composition; gate stack structure; microwave microscope; phase diagram; structural analysis; Capacitance-voltage characteristics; Composite materials; Dielectric materials; Dielectric measurements; Hafnium oxide; Microscopy; Microwave devices; Microwave theory and techniques; Permittivity; Tuning;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    1-4244-0160-7
  • Electronic_ISBN
    1-4244-0161-5
  • Type

    conf

  • DOI
    10.1109/ICSICT.2006.306265
  • Filename
    4098122