Title :
Next Generation Smart Power Technologies - Challenges and Innovations Enabling Complex SoC Integration
Author :
Tack, Marnix ; Moens, Peter ; Gillon, Renaud ; Janssens, Johan ; Van Roeyen, Stefan ; Sevenhans, Jan
Author_Institution :
AMIS, Oudenaarde
Abstract :
This paper highlights the key figure-of-merits of SPTs and ongoing technology innovations, such as vertical DMOS switches, Deep Trench Isolation, Power Metal, and SOA-simulation. Examples are given of automotive and telecom applications that benefit from these advanced SPTs. As such these developments will enable truly Smart Power SoC applications.
Keywords :
power integrated circuits; SoC integration; smart power technologies; Automotive engineering; Capacitance; Circuits; Electrostatic discharge; Isolation technology; Semiconductor optical amplifiers; Switches; Technological innovation; Vehicle dynamics; Voltage;
Conference_Titel :
Solid-State Circuits Conference, 2008. ISSCC 2008. Digest of Technical Papers. IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4244-2010-0
Electronic_ISBN :
978-1-4244-2011-7
DOI :
10.1109/ISSCC.2008.4523174
