The particle-size-controllable growth of silica sol abrasive for chemical mechanical polishing

In the further development of chemical mechanical polishing (CMP) process, it needs badly to have a sort of low polydispersion index (PDI) and high purity silica sol nanometer abrasives which can be stable for a long time. In this paper, through a large number of experiments, we have proposed the optimization process schemes and pyramid shape grow mode in preparing large particle size silica sol, realizing particle size controllable to grow, producing the silica sol of different specifications: 10 ~ 15nm, 20 ~ 25 nm, 30 ~ 40nm, 50 ~ 60nm, 80 ~ 90nm, 110 ~ 130nm, etc, among, the silica sol with large particle size has a low viscidity (1.431mpa middot s), low polydispersion index (1.002), high mechanical intension, satisfying for the need of mechanical polishing of CMP