Correlation of surface mount plastic package reliability testing to nondestructive inspection by scanning acoustic microscopy

Author

Moore, T.M. ; McKenna, R. ; Kelsall, S.J.

Author_Institution

Texas Instrum. Inc., Dallas, TX, USA

fYear

1991

fDate

9-11 April 1991

Firstpage

160

Lastpage

166

Abstract

The effects of delamination at the mold component/die interface during reliability testing are investigated using scanning acoustic microscopy (SAM), and electrical and physical analyses. The SAM results are correlated with electrical end point (EEP) tests and destructive physical analysis. The spread of delamination during temperature cycling of units is examined. It is demonstrated that scanning acoustic microscopy provides a significant improvement over cross sectioning for the inspection of critical defects in IC packages. The impact of this result on a test method for package reliability evaluation based on inspection for package cracks is discussed.<>

Keywords

acoustic microscopy; inspection; nondestructive testing; packaging; reliability; surface mount technology; SAM; critical defects; delamination; destructive physical analysis; electrical end point; inspection; nondestructive inspection; package cracks; reliability testing; scanning acoustic microscopy; surface mount plastic package; temperature cycling; Acoustic testing; Delamination; Electronic packaging thermal management; Inspection; Instruments; Microscopy; Moisture; Nondestructive testing; Plastic integrated circuit packaging; Plastic packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium, 1991, 29th Annual Proceedings., International

Conference_Location

Las Vegas, NV, USA

Print_ISBN

0-87942-680-2

Type

conf

DOI

10.1109/RELPHY.1991.146005

Filename

146005