Title :
Correlation of surface mount plastic package reliability testing to nondestructive inspection by scanning acoustic microscopy
Author :
Moore, T.M. ; McKenna, R. ; Kelsall, S.J.
Author_Institution :
Texas Instrum. Inc., Dallas, TX, USA
Abstract :
The effects of delamination at the mold component/die interface during reliability testing are investigated using scanning acoustic microscopy (SAM), and electrical and physical analyses. The SAM results are correlated with electrical end point (EEP) tests and destructive physical analysis. The spread of delamination during temperature cycling of units is examined. It is demonstrated that scanning acoustic microscopy provides a significant improvement over cross sectioning for the inspection of critical defects in IC packages. The impact of this result on a test method for package reliability evaluation based on inspection for package cracks is discussed.<>
Keywords :
acoustic microscopy; inspection; nondestructive testing; packaging; reliability; surface mount technology; SAM; critical defects; delamination; destructive physical analysis; electrical end point; inspection; nondestructive inspection; package cracks; reliability testing; scanning acoustic microscopy; surface mount plastic package; temperature cycling; Acoustic testing; Delamination; Electronic packaging thermal management; Inspection; Instruments; Microscopy; Moisture; Nondestructive testing; Plastic integrated circuit packaging; Plastic packaging;
Conference_Titel :
Reliability Physics Symposium, 1991, 29th Annual Proceedings., International
Conference_Location :
Las Vegas, NV, USA
Print_ISBN :
0-87942-680-2
DOI :
10.1109/RELPHY.1991.146005
