• DocumentCode
    3464715
  • Title

    Effects of curvature on the fabrication of wraparound antennas

  • Author

    Thomas, W. ; Hall, R.C. ; Wu, D.I.

  • Author_Institution
    Boulder Microwave Technol. Inc., CO, USA
  • Volume
    3
  • fYear
    1997
  • fDate
    13-18 July 1997
  • Firstpage
    1512
  • Abstract
    The extension of the microstrip antenna design from planar to cylindrical structures introduces a variety of complications, both in the modeling and fabrication of the structures. Parametric variations due to curvature can be determined theoretically, but it has been found that the process of shaping planar microwave materials into cylinders can cause significant changes to their electrical and physical properties which must be taken into account when designing antenna elements and feed circuitry. The material issues that arise during fabrication of conformal microstrip antennas are discussed in this paper. Several cylindrical microstrip patch antennas were designed using Boulder Microwave Technologies Clementine (R) software. Allowances for the changes that occur in the material as a result of formation were included both as adjustments to the material parameters input into the program, and to the dimensions of the resulting designs. These designs were then fabricated and measured for comparison with simulated results.
  • Keywords
    antenna radiation patterns; conformal antennas; microstrip antennas; 2.0 to 2.5 GHz; Boulder Microwave Technologies Clementine (R) software; UHF antenna; antenna elements; conformal microstrip antennas; curvature; cylindrical microstrip patch antennas; design; fabrication; feed circuitry; microstrip antenna design; parametric variations; planar microwave materials; wraparound antennas; Conducting materials; Copper; Dielectric materials; Dielectric measurements; Dielectric substrates; Fabrication; Laminates; Microstrip antennas; Microwave technology; Wrapping;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation Society International Symposium, 1997. IEEE., 1997 Digest
  • Conference_Location
    Montreal, Quebec, Canada
  • Print_ISBN
    0-7803-4178-3
  • Type

    conf

  • DOI
    10.1109/APS.1997.631458
  • Filename
    631458