DocumentCode :
3465280
Title :
A novel monolithic CMOS capacitive pressure sensor
Author :
Liu, Na ; Huang, Qing-An ; Qin, Ming
Author_Institution :
Key Lab. of MEMS of Minist. of Educ., Southeast Univ., Nanjing
fYear :
2006
fDate :
Oct. 2006
Firstpage :
611
Lastpage :
613
Abstract :
This paper reports a novel monolithic capacitive pressure sensor based on the standard CMOS process and post-processing. The sensing part is a variable capacitor with a poly-gate/gate oxide/n-well Si structure. Poly-gate and n-well Si in the CMOS process are the top and bottom electrodes, respectively, while the center layer is the gate oxide. After CMOS process, selectively etching bulk silicon, PN junction self etch-stop and anodic bonding to the glass are used to get the microstructure. Compared with the traditional capacitive pressure sensor, this structure has intrinsic larger initial capacitance value which benefits the following interface circuits and high sensitivity. For the 800um times 800 mum sensor structure, the sensitivity can be 46fF/hPa.Then the sensor is read out using a relaxation oscillator and a D flip-flop with the resolution of 3.2 Hz/hPa
Keywords :
CMOS integrated circuits; bonding processes; capacitive sensors; etching; flip-flops; microsensors; pressure sensors; readout electronics; relaxation oscillators; silicon; 800 micron; CMOS process; D flip-flop; anodic bonding; interface circuits; monolithic CMOS capacitive pressure sensor; read out circuit; relaxation oscillator; selective etching; self etch-stop; variable capacitor; Bonding; CMOS process; Capacitance; Capacitive sensors; Capacitors; Electrodes; Etching; Glass; Microstructure; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0160-7
Electronic_ISBN :
1-4244-0161-5
Type :
conf
DOI :
10.1109/ICSICT.2006.306391
Filename :
4098183
Link To Document :
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