Title :
A Multi-Level-Cell Bipolar-Selected Phase-Change Memory
Author :
Bedeschi, Ferdinando ; Fackenthal, Rich ; Resta, Claudio ; Donze, Enzo Michele ; Jagasivamani, Meenatchi ; Buda, Egidio ; Pellizzer, Fabio ; Chow, David ; Cabrini, Alessandro ; Calvi, Giacomo Matteo Angelo ; Faravelli, Roberto ; Fantini, Andrea ; Torelli,
Author_Institution :
STMicroelectronics, Agrate
Abstract :
Phase-change memory (PCM) is becoming widely recognized as the most likely candidate to unify the many memory technologies that exist today (Lee, et al., 2007). The combination of non-volatile attributes of flash, RAM-like bit-alterability, and fast reads and writes position PCM to enable changes in the memory subsystems of cellular phones, PCs and countless embedded and consumer electronics applications. This design´s multi-level cell (MLC) capabilities combined with long- term scalability reduce PCM costs as only realized before by hard disk drives. MLC technology is challenged with fitting more cell states (4 in the case of 2 bit per cell), along with distribution spreads due to process, design, and environmental variations, within a limited window. We describe a 256Mb MLC test-chip in a 90nm micro-trench (mutrench) PCM technology, and MLC endurance results from an 8Mb 0.18mum PCM test-chip with the same trench cell structure. A program algorithm achieving tightly placed inner states and experimental results illustrating distinct current distributions are presented to demonstrate MLC capability.
Keywords :
flash memories; phase change materials; random-access storage; MLC technology; RAM; current distributions; flash memories; memory subsystems; micro-trench PCM technology; multilevel cell technology; phase-change memory; size 0.18 mum; size 90 nm; storage capacity 8 Mbit; trench cell structure; Cellular phones; Consumer electronics; Nonvolatile memory; Personal communication networks; Phase change materials; Phase change memory; Random access memory; Read-write memory; Scalability; Testing;
Conference_Titel :
Solid-State Circuits Conference, 2008. ISSCC 2008. Digest of Technical Papers. IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4244-2010-0
Electronic_ISBN :
978-1-4244-2011-7
DOI :
10.1109/ISSCC.2008.4523240