DocumentCode :
3465943
Title :
Recent progress in ferroelectirc memory technology
Author :
Ishiwara, Hiroshi
Author_Institution :
Interdisciplinary Graduate Sch. of Sci. & Eng., Tokyo Inst. of Technol.
fYear :
2006
fDate :
23-26 Oct. 2006
Firstpage :
713
Lastpage :
716
Abstract :
Recent progress in ferroelectric random access memory (FeRAM) technology is reviewed from viewpoints of materials, devices, and circuits. First, insulating and ferroelectric properties of pure and Mn-substituted BiFeO3 thin films are discussed. It is shown that Mn substitution at the Fe site is effective in improving the breakdown characteristics of the films and obtaining saturated polarization vs electric field (P-E) hysteresis loops at room temperature. Then, memory characteristics of FET-type FeRAM are discussed. It is shown that on-and off-currents in a ferroelectric-gate FET can be retained over 30 days when a HfO2 buffer layer is inserted between the ferroelectric film and Si substrate in the gate structure. Finally, recent progress in another FET-type memory, 1T2C-type FeRAM, is introduced, in which the operation characteristics of 1k-bit memory array are mainly discussed
Keywords :
bismuth compounds; electric breakdown; ferroelectric storage; hafnium compounds; iron compounds; manganese; random-access storage; silicon; BiFeO3; HfO2; Mn; breakdown characteristics; electric field hysteresis loops; ferroelectric film; ferroelectric random access memory technology; saturated polarization; Electric breakdown; Ferroelectric films; Ferroelectric materials; Hysteresis; Insulation; Iron; Nonvolatile memory; Polarization; Random access memory; Thin film circuits;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0160-7
Electronic_ISBN :
1-4244-0161-5
Type :
conf
DOI :
10.1109/ICSICT.2006.306466
Filename :
4098214
Link To Document :
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