COB and COC for low cost and high density package

Author

Rochat, Georges

Author_Institution

Valtronic USA Inc., Solon, OH, USA

fYear

1995

fDate

2-4 Oct 1995

Firstpage

109

Lastpage

111

Abstract

Today, portable electronic devices have many more functions than the same type of nonportable products had a few years ago. As the similitude rules are no longer valid when designers are faced with miniaturization, it is necessary to find and develop new approaches for the packaging and the interconnections of the integrated circuits. By using a well mastered Chip-On-Board (COB) technology in association with a very accurate die attach process, it is possible to offer an inexpensive Chip-On-Chip (COC) solution to the engineers who need a 3D assembly for a higher level of miniaturization

Keywords

circuit optimisation; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; integrated circuit yield; microassembling; 3D assembly; COB; COC; IC interconnections; IC packaging; chip-on-board technology; chip-on-chip solution; die attach process; high density package; portable electronic devices; Assembly; Bonding; Circuit testing; Costs; Curing; Electronics packaging; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit technology; Microassembly; Resins; Thermal stresses; Thermomechanical processes;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International

Conference_Location

Austin, TX

Print_ISBN

0-7803-2996-1

Type

conf

DOI

10.1109/IEMT.1995.526101

Filename

526101