Title :
90nm 4.7ps-Resolution 0.7-LSB Single-Shot Precision and 19pJ-per-Shot Local Passive Interpolation Time-to-Digital Converter with On-Chip Characterization
Author :
Henzler, Stephan ; Koeppe, Siegmar ; Kamp, Winfried ; Mulatz, Hans ; Schmitt-Landsiedel, Doris
Author_Institution :
Infineon Technol., Munich
Abstract :
Time-to-digital converters (TDC) support the industry wide trend of replacing mixed-signal functionality by digital realizations. High-resolution TDCs become increasingly popular for time-of-flight measurements, full-speed testing, e.g., jitter measurement, clock and data recovery, measurement and instrumentation, and digital PLLs. As the speed leverage of technology scaling decreases below 100nm, robust TDCs with sub-gate-delay resolution are essential. The Vernier TDC requires long delay lines, thus suffers from large latency, area and power consumption. Latency and a resolution limited by the inherent variation-related pulse-width modification are the drawbacks of the pulse-shrinking approach. Parallel gradual-delay elements are particularly susceptible to process variations. The same holds for analog operations on time intervals like delay amplification. Ultra high-resolution TDCs achieve sub-ps resolution but require iterative conversion.
Keywords :
analogue-digital conversion; Vernier TDC; clock recovery; data recovery; delay amplification; delay lines; digital PLL; energy 19 pJ; iterative conversion; jitter measurement; local passive interpolation; mixed-signal functionality; on-chip characterization; parallel gradual-delay elements; process variations; pulse-shrinking approach; single-shot precision; size 90 nm; sub-gate-delay resolution; time 4.7 ps; time-of-flight measurements; time-to-digital converter; variation-related pulse-width modification; Clocks; Delay lines; Energy consumption; Instruments; Interpolation; Jitter; Pulse amplifiers; Robustness; Space vector pulse width modulation; Testing;
Conference_Titel :
Solid-State Circuits Conference, 2008. ISSCC 2008. Digest of Technical Papers. IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4244-2010-0
Electronic_ISBN :
978-1-4244-2011-7
DOI :
10.1109/ISSCC.2008.4523300