Title :
Balanced SiGe PA Module for Multi-Band and Multi-Mode Cellular-Phone Applications
Author :
Scuderi, Antonino ; Santagati, Carmelo ; Vaiana, Michele ; Pidalá, Francesco ; Paparo, Mario
Author_Institution :
STMicroelectronics, Catania
Abstract :
In this paper, the integration of a MM (GSM/EDGE/WCDMA) MB (850/900MHz, 1800/1900/2100MHz) 50 Omega-matched isolator-less flip-chip PAs, capable of envelope and power tracking operation, is discussed. The PAs are integrated in a 0.25 mum SiGe technology and are soldered on a 4-layer substrate. The system is hosted in a 6 x 8 mm2 plastic module.
Keywords :
Ge-Si alloys; cellular radio; power amplifiers; SiGe; glass IPD chip; multiband cellular phone; multimode cellular phone; passive isolator removal; power amplifier module; Capacitors; Directional couplers; Filters; GSM; Germanium silicon alloys; Inductors; Isolators; Multiaccess communication; Radio frequency; Silicon germanium;
Conference_Titel :
Solid-State Circuits Conference, 2008. ISSCC 2008. Digest of Technical Papers. IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4244-2010-0
Electronic_ISBN :
978-1-4244-2011-7
DOI :
10.1109/ISSCC.2008.4523312
