• DocumentCode
    3466909
  • Title

    Balanced SiGe PA Module for Multi-Band and Multi-Mode Cellular-Phone Applications

  • Author

    Scuderi, Antonino ; Santagati, Carmelo ; Vaiana, Michele ; Pidalá, Francesco ; Paparo, Mario

  • Author_Institution
    STMicroelectronics, Catania
  • fYear
    2008
  • fDate
    3-7 Feb. 2008
  • Firstpage
    572
  • Lastpage
    637
  • Abstract
    In this paper, the integration of a MM (GSM/EDGE/WCDMA) MB (850/900MHz, 1800/1900/2100MHz) 50 Omega-matched isolator-less flip-chip PAs, capable of envelope and power tracking operation, is discussed. The PAs are integrated in a 0.25 mum SiGe technology and are soldered on a 4-layer substrate. The system is hosted in a 6 x 8 mm2 plastic module.
  • Keywords
    Ge-Si alloys; cellular radio; power amplifiers; SiGe; glass IPD chip; multiband cellular phone; multimode cellular phone; passive isolator removal; power amplifier module; Capacitors; Directional couplers; Filters; GSM; Germanium silicon alloys; Inductors; Isolators; Multiaccess communication; Radio frequency; Silicon germanium;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference, 2008. ISSCC 2008. Digest of Technical Papers. IEEE International
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    978-1-4244-2010-0
  • Electronic_ISBN
    978-1-4244-2011-7
  • Type

    conf

  • DOI
    10.1109/ISSCC.2008.4523312
  • Filename
    4523312
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3466909