• DocumentCode
    3467829
  • Title

    Object imaging with a multiplexed piezoelectric polymer tactile sensor

  • Author

    Kolesar, Edward S., Jr. ; Reston, Rocky R. ; Ford, Douglas G. ; Fitch, Robert C., Jr.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA
  • fYear
    1993
  • fDate
    1-3 Aug. 1993
  • Firstpage
    280
  • Lastpage
    283
  • Abstract
    A two-dimensional, electrically multiplexed robotic tactile sensor fabricated by coupling a piezoelectric polyvinylidene fluoride (PVDF) polymeric film to a monolithic silicon integrated circuit (IC) is discussed. The integrated circuit incorporates 25 sensor electrodes arranged in a symmetrical 5*5 matrix. Each electrode occupies a 600- mu m by 600- mu m square area. A 25- mu m-thick PVDF film was attached to the electrode array with a nonconductive adhesive. The response of the tactile sensor is essentially linear for loads spanning 0.8 to 60 grams of force (GMF). The response bandwidth is 33 Hz, the hysteresis level is very small, and taxel crosstalk is not a significant problem. A precharge bias scheme has been implemented to stabilize the pre- and post-load sensor response. A simple tactile object image measurement process was evaluated to recognize the shapes of circular, rectangular, toroidal, and hexagonal loads.<>
  • Keywords
    MOS integrated circuits; computer vision; piezoelectric transducers; polymer films; robots; signal processing equipment; tactile sensors; 25 micron; 33 Hz; MOSIC; circular load; hexagonal loads; monolithic silicon integrated circuit; multiplexed piezoelectric polymer tactile sensor; piezoelectric polyvinylidene fluoride polymeric film; precharge bias scheme; rectangular load; sensor response; taxel crosstalk; toroidal load; MOS integrated circuits; Machine vision; Piezoelectric transducers; Plastic films; Robots; Tactile sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Systems Engineering, 1991., IEEE International Conference on
  • Conference_Location
    Dayton, OH, USA
  • Print_ISBN
    0-7803-0173-0
  • Type

    conf

  • DOI
    10.1109/ICSYSE.1991.161133
  • Filename
    161133