• DocumentCode
    3468224
  • Title

    Development of integrated process control system utilizing neural network for plasma etching

  • Author

    Koh, Taek-Beom ; Cha, Sang-Yeob ; Woo, KwangBang ; Moon, Dae-Sik ; Kwak, KyuHwan ; Chang, HoSeung

  • Author_Institution
    Dept. of Electr. Eng., Yonsei Univ., Seoul, South Korea
  • fYear
    1995
  • fDate
    2-4 Oct 1995
  • Firstpage
    218
  • Lastpage
    223
  • Abstract
    The purpose of this study is to provide the integrated process control system utilizing neural network modeling, to search for the appropriate choice of control input, and to keep the process output within the desired range in the real etch process. Variations in the process output are classified as the drift and the shift. The drift is caused by a natural noise that changes over a period of time slowly and steadily partly due to the aging of equipment. Although the drift moves the process output away from the target value, its variation is infinitesimal. On the other hand, the shift results in a larger variation due to the various causes and its width is normally greater than that of the drift. Without appropriate procedures, the process output will move away from the target value greatly. Therefore the control strategy is to minimize the process shifts, in which process outputs are measured by monitoring wafers periodically
  • Keywords
    neural nets; process control; semiconductor process modelling; sputter etching; aging; drift; integrated process control; neural network model; noise; plasma etching; shift; Aging; Etching; Genetic algorithms; Monitoring; Neural networks; Optimal control; Plasma applications; Plasma devices; Plasma materials processing; Process control; Random access memory;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International
  • Conference_Location
    Austin, TX
  • Print_ISBN
    0-7803-2996-1
  • Type

    conf

  • DOI
    10.1109/IEMT.1995.526118
  • Filename
    526118