Title :
Measurements of thermal conductivity and specific heat of lead free solder
Author :
Lloyd, John R. ; Zhang, Chao ; Tan, H. Leong ; Shangguan, Dongkai ; Achari, Achyuta
Author_Institution :
Dept. of Mech. Eng., Michigan State Univ., East Lansing, MI, USA
Abstract :
Thermal processes in the manufacture of solder joints are critical to the production of high quality electronic packaging. Thermal conductivity, thermal diffusivity and volumetric heat capacity are thermophysical properties of solder material that control the thermal aspects of the soldering process. As lead based solder materials are targeted for elimination from electronics manufacture, the need to understand the thermal properties of the new attachment materials to be used are critical for quality control as well as for energy consumption and environmental impact of the manufacturing process. Lead free solder materials are expected to be the predominant attachment material in the near future
Keywords :
electronic equipment manufacture; environmental factors; integrated circuit packaging; packaging; quality control; soldering; specific heat; thermal conductivity; thermal diffusivity; attachment materials; electronics manufacture; energy consumption; environmental impact; high quality electronic packaging; lead free solder; quality control; solder joints; soldering process; specific heat; thermal conductivity; thermal diffusivity; volumetric heat capacity; Conducting materials; Conductivity measurement; Electronic packaging thermal management; Electronics packaging; Environmentally friendly manufacturing techniques; Lead; Manufacturing processes; Production; Soldering; Thermal conductivity;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-2996-1
DOI :
10.1109/IEMT.1995.526123
