• DocumentCode
    3468334
  • Title

    Total contamination control: the minienvironment era

  • Author

    Abuzeid, Salem

  • Author_Institution
    Minienviron. Bus. Unit, Asyst Tech. Inc., Fremont, CA, USA
  • fYear
    1995
  • fDate
    2-4 Oct 1995
  • Firstpage
    269
  • Lastpage
    276
  • Abstract
    Semiconductor manufacturers clearly recognize that shrinking geometries in semiconductor devices require more stringent process and contamination control. The application of isolation technology for the reduction and control of particulate contamination levels has moved from the development and evaluation stage to its current status as a preferred alternative for new semiconductor manufacturing facilities. A system based on Standard Mechanical Interfaces (SMIF), which uses clean isolation technology to protect the integrity of the wafers during processing, storage and transportation within the facility, is described. An extension of the same principle of isolation, based on the SMIF-technology, enables a selected inert environment to be furnished in the process tool area as well as in the transport and storage containers. The technology enables control of particles, oxygen and water vapor levels (to the 10 PPM range), organic vapor and gas phase contaminant. The capabilities of the minienvironment technology and its benefits are analyzed
  • Keywords
    clean rooms; integrated circuit yield; isolation technology; process control; gas phase contaminant; inert environment; isolation technology; minienvironment era; particle control; process tool area; semiconductor manufacturing facilities; standard mechanical interfaces; total contamination control; water vapor levels; Contamination; Geometry; Isolation technology; Manufacturing processes; Process control; Production facilities; Protection; Semiconductor device manufacture; Semiconductor devices; Transportation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International
  • Conference_Location
    Austin, TX
  • Print_ISBN
    0-7803-2996-1
  • Type

    conf

  • DOI
    10.1109/IEMT.1995.526125
  • Filename
    526125