Title :
Total contamination control: the minienvironment era
Author_Institution :
Minienviron. Bus. Unit, Asyst Tech. Inc., Fremont, CA, USA
Abstract :
Semiconductor manufacturers clearly recognize that shrinking geometries in semiconductor devices require more stringent process and contamination control. The application of isolation technology for the reduction and control of particulate contamination levels has moved from the development and evaluation stage to its current status as a preferred alternative for new semiconductor manufacturing facilities. A system based on Standard Mechanical Interfaces (SMIF), which uses clean isolation technology to protect the integrity of the wafers during processing, storage and transportation within the facility, is described. An extension of the same principle of isolation, based on the SMIF-technology, enables a selected inert environment to be furnished in the process tool area as well as in the transport and storage containers. The technology enables control of particles, oxygen and water vapor levels (to the 10 PPM range), organic vapor and gas phase contaminant. The capabilities of the minienvironment technology and its benefits are analyzed
Keywords :
clean rooms; integrated circuit yield; isolation technology; process control; gas phase contaminant; inert environment; isolation technology; minienvironment era; particle control; process tool area; semiconductor manufacturing facilities; standard mechanical interfaces; total contamination control; water vapor levels; Contamination; Geometry; Isolation technology; Manufacturing processes; Process control; Production facilities; Protection; Semiconductor device manufacture; Semiconductor devices; Transportation;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-2996-1
DOI :
10.1109/IEMT.1995.526125