DocumentCode
3468523
Title
Bias Temperature Instability in MOSFETs with Atomic-Layer-Deposited Si-Nitride/SiO2 Stack Gate Dielectrics
Author
Zhu, Shiyang ; Nakajima, Anri ; Ohashi, Takuo ; Miyake, Hideharu
Author_Institution
Res. Center for Nanodevices & Syst., Hiroshima Univ.
fYear
2006
fDate
23-26 Oct. 2006
Firstpage
1126
Lastpage
1128
Abstract
Compared with conventional SiON MOSFETs, p+-poly-Si gated MOSFETs with atomic-layer-deposited Si-nitride/SiO2 stack gate dielectrics exhibit quite different bias temperature instability (BTI) behaviors: NMOS under positive BT stress degrades significantly with the stress voltage increasing; PMOS under negative BT stress exhibits a turnaround threshold voltage shift; etc. The abnormal BTI behaviors indicate the existence of preexisting traps in the stack film, most probably at the SiN/SiO2 interface
Keywords
MOSFET; atomic layer deposition; dielectric materials; silicon compounds; stability; SiN-SiO2; atomic-layer-deposited stack gate dielectrics; bias temperature instability; p+-poly-Si gated MOSFET; Boron; Degradation; Dielectrics; MOS devices; MOSFETs; Niobium compounds; Nitrogen; Stress; Temperature; Titanium compounds;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
Conference_Location
Shanghai
Print_ISBN
1-4244-0160-7
Electronic_ISBN
1-4244-0161-5
Type
conf
DOI
10.1109/ICSICT.2006.306701
Filename
4098342
Link To Document