• DocumentCode
    3468523
  • Title

    Bias Temperature Instability in MOSFETs with Atomic-Layer-Deposited Si-Nitride/SiO2 Stack Gate Dielectrics

  • Author

    Zhu, Shiyang ; Nakajima, Anri ; Ohashi, Takuo ; Miyake, Hideharu

  • Author_Institution
    Res. Center for Nanodevices & Syst., Hiroshima Univ.
  • fYear
    2006
  • fDate
    23-26 Oct. 2006
  • Firstpage
    1126
  • Lastpage
    1128
  • Abstract
    Compared with conventional SiON MOSFETs, p+-poly-Si gated MOSFETs with atomic-layer-deposited Si-nitride/SiO2 stack gate dielectrics exhibit quite different bias temperature instability (BTI) behaviors: NMOS under positive BT stress degrades significantly with the stress voltage increasing; PMOS under negative BT stress exhibits a turnaround threshold voltage shift; etc. The abnormal BTI behaviors indicate the existence of preexisting traps in the stack film, most probably at the SiN/SiO2 interface
  • Keywords
    MOSFET; atomic layer deposition; dielectric materials; silicon compounds; stability; SiN-SiO2; atomic-layer-deposited stack gate dielectrics; bias temperature instability; p+-poly-Si gated MOSFET; Boron; Degradation; Dielectrics; MOS devices; MOSFETs; Niobium compounds; Nitrogen; Stress; Temperature; Titanium compounds;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    1-4244-0160-7
  • Electronic_ISBN
    1-4244-0161-5
  • Type

    conf

  • DOI
    10.1109/ICSICT.2006.306701
  • Filename
    4098342