• DocumentCode
    3468594
  • Title

    Dynamic NBTI characteristics of p-MOSFET with N-plasma SiON Gate Dielectric

  • Author

    Yan, B.G. ; Kang, J.F. ; Sa, N. ; Liu, X.Y. ; Du, G. ; Han, R.Q. ; Liao, C.C. ; Gan, Z.H. ; Liao, M. ; Wang, J.P. ; Wong, W.

  • Author_Institution
    Inst. of Microelectron., Peking Univ., Beijing
  • fYear
    2006
  • fDate
    23-26 Oct. 2006
  • Firstpage
    1138
  • Lastpage
    1140
  • Abstract
    In this paper, the dynamic negative bias temperature instability (DNBTI) characteristics of p-MOSFET with N-plasma SiON dielectric are studied. Under dynamic stress, the nearly consistent frequency dependent characteristics of threshold voltage shift (DeltaVth) and interface trap density (DeltaNit) were observed. The results show that the degradation and recovery of DNBTI are still dominated by the generation and passivation of the interfacial traps associated with Si-H bond breaking and released H species diffusion during stress phase and back diffusion of H and repassivation of broken equivSi bonds during passivation phase, which could be depicted by the so-called reaction-diffusion (R-D) model. Meanwhile, the reduced passivation effect with increased stress time was observed, which suggests that the generation and passivation of Nit seems to present a fatigue effect. These observed DNBTI characteristics may relate to the nitrogen trapping effect on the diffusion of H species in SiON dielectric layer
  • Keywords
    MOSFET; dielectric materials; hydrogen; interface states; nitrogen; passivation; reaction-diffusion systems; semiconductor device models; silicon; silicon compounds; thermal stability; H species diffusion; N-plasma SiON gate dielectric; Si-H; Si-H bond; SiON; SiON dielectric layer; dynamic NBTI characteristics; dynamic negative bias temperature instability; dynamic stress; fatigue effect; interface trap density; interfacial traps; nitrogen trapping effect; p-MOSFET; passivation effect; reaction-diffusion model; threshold voltage shift; Dielectrics; Diffusion bonding; Frequency dependence; MOSFET circuits; Negative bias temperature instability; Niobium compounds; Passivation; Stress; Threshold voltage; Titanium compounds;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    1-4244-0160-7
  • Electronic_ISBN
    1-4244-0161-5
  • Type

    conf

  • DOI
    10.1109/ICSICT.2006.306055
  • Filename
    4098346