DocumentCode :
3468785
Title :
The effects of incorporating nitrogen into silicon dioxide on gate leakage current in MOSFETs
Author :
Mao, L.F. ; Wang, Z.O. ; Wang, J.Y.
Author_Institution :
Sch. of Electron. & Inf. Eng., Soochow Univ., Suzhou
fYear :
2006
fDate :
23-26 Oct. 2006
Firstpage :
1171
Lastpage :
1173
Abstract :
Based on the first principles calculations, the band structure properties of lightly nitride silicon oxide are studied. Two gate leakage current mechanisms were found: one is direct tunneling, the other is defect assisted tunneling for higher nitrogen atom concentration. The tunneling currents through silicon dioxide/SiO1.875N0.083 stacks were calculated. The calculated results show that the gate leakage current can be reduced largely for a small nitrogen atom concentration. In other words, silicon oxynitride dielectric film with a special nitrogen atom concentration can greatly extend the oxide-equivalent thickness
Keywords :
MOSFET; dielectric thin films; leakage currents; silicon compounds; tunnelling; MOSFET; SiO2-SiO1.875N0.083; defect assisted tunneling; dielectric film; direct tunneling; gate leakage current; nitrogen atom concentration; silicon dioxide; silicon oxynitride; Atomic measurements; Density functional theory; Dielectrics; Electrons; Leakage current; MOSFETs; Nitrogen; Photonic band gap; Silicon compounds; Tunneling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0160-7
Electronic_ISBN :
1-4244-0161-5
Type :
conf
DOI :
10.1109/ICSICT.2006.306066
Filename :
4098357
Link To Document :
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