• DocumentCode
    3468785
  • Title

    The effects of incorporating nitrogen into silicon dioxide on gate leakage current in MOSFETs

  • Author

    Mao, L.F. ; Wang, Z.O. ; Wang, J.Y.

  • Author_Institution
    Sch. of Electron. & Inf. Eng., Soochow Univ., Suzhou
  • fYear
    2006
  • fDate
    23-26 Oct. 2006
  • Firstpage
    1171
  • Lastpage
    1173
  • Abstract
    Based on the first principles calculations, the band structure properties of lightly nitride silicon oxide are studied. Two gate leakage current mechanisms were found: one is direct tunneling, the other is defect assisted tunneling for higher nitrogen atom concentration. The tunneling currents through silicon dioxide/SiO1.875N0.083 stacks were calculated. The calculated results show that the gate leakage current can be reduced largely for a small nitrogen atom concentration. In other words, silicon oxynitride dielectric film with a special nitrogen atom concentration can greatly extend the oxide-equivalent thickness
  • Keywords
    MOSFET; dielectric thin films; leakage currents; silicon compounds; tunnelling; MOSFET; SiO2-SiO1.875N0.083; defect assisted tunneling; dielectric film; direct tunneling; gate leakage current; nitrogen atom concentration; silicon dioxide; silicon oxynitride; Atomic measurements; Density functional theory; Dielectrics; Electrons; Leakage current; MOSFETs; Nitrogen; Photonic band gap; Silicon compounds; Tunneling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    1-4244-0160-7
  • Electronic_ISBN
    1-4244-0161-5
  • Type

    conf

  • DOI
    10.1109/ICSICT.2006.306066
  • Filename
    4098357