DocumentCode :
3469071
Title :
Nonisothermal Effects in SOI CMOS Analog Integrated Circuits Based on Electrothermal Simulation
Author :
Cheng, Ming-C ; Yu, Feixia
fYear :
2006
fDate :
23-26 Oct. 2006
Firstpage :
1252
Lastpage :
1255
Abstract :
An analytical approach to electrothermal simulation of SOI integrated circuits is presented, accounting for large temperature gradients in the devices. Electrothermal simulations of SOI analog circuits in Spice coupled with the nonisothermal approach are performed and compared with the isothermal BSIMSOI thermal circuit. Heat flow, thermal coupling and self-heating effects in some SOI analog integrated circuits are examined. Nonisothermal effects on some electrical properties of analog circuits are also briefly discussed
Keywords :
CMOS analogue integrated circuits; SPICE; silicon-on-insulator; SOI CMOS analog integrated circuits; electrothermal simulation; heat flow; nonisothermal effects; self-heating effects; thermal coupling; Analog circuits; Analog integrated circuits; Analytical models; CMOS analog integrated circuits; Circuit simulation; Coupling circuits; Electrothermal effects; Integrated circuit modeling; Isothermal processes; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0160-7
Electronic_ISBN :
1-4244-0161-5
Type :
conf
DOI :
10.1109/ICSICT.2006.306106
Filename :
4098375
Link To Document :
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