Title :
Nonisothermal Effects in SOI CMOS Analog Integrated Circuits Based on Electrothermal Simulation
Author :
Cheng, Ming-C ; Yu, Feixia
Abstract :
An analytical approach to electrothermal simulation of SOI integrated circuits is presented, accounting for large temperature gradients in the devices. Electrothermal simulations of SOI analog circuits in Spice coupled with the nonisothermal approach are performed and compared with the isothermal BSIMSOI thermal circuit. Heat flow, thermal coupling and self-heating effects in some SOI analog integrated circuits are examined. Nonisothermal effects on some electrical properties of analog circuits are also briefly discussed
Keywords :
CMOS analogue integrated circuits; SPICE; silicon-on-insulator; SOI CMOS analog integrated circuits; electrothermal simulation; heat flow; nonisothermal effects; self-heating effects; thermal coupling; Analog circuits; Analog integrated circuits; Analytical models; CMOS analog integrated circuits; Circuit simulation; Coupling circuits; Electrothermal effects; Integrated circuit modeling; Isothermal processes; Temperature;
Conference_Titel :
Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0160-7
Electronic_ISBN :
1-4244-0161-5
DOI :
10.1109/ICSICT.2006.306106