Optimal sensor placement for fault diagnosis

Ability to detect and to isolate faults which may affect the system depends essentially on instrumentation architecture. This is why, before designing an industrial supervision system, determination of monitoring ability based on technical specifications is important. Used methods in the consulted literature are based on a model given as a set of collected data in different modes (faulty and normal) or under complex differential equations. In the present paper it will be shown how the behavioral, structural and causal properties of the bond graph model can be used for monitoring ability analysis (which part of the system is over, just or under constrained) with no need of calculation. The developed method is applied to the designing a real time monitoring of an electromechanical system.