Title :
An ESD Protection Device Simulation-Design Methodology based on MEDICI
Author :
Li, Bin ; Li, Ruoyu ; Luo, Hongwei
Author_Institution :
Dept. of Microelectron., South China Univ. of Technol., Guangzhou
Abstract :
In this paper, MEDICI was used to simulate ESD device by coupling the electrothermal effects. The effects of size parameters on the ESD robustness are discussed. The response time of ESD protection circuit is also analyzed. Tape-outs under different processes exhibited satisfactory ESD robustness, with higher than 4000V in CSMC 0.6 mum process and 3500V in HHNEC 0.25 mum process. It is testified that this methodology is effective
Keywords :
electrostatic discharge; integrated circuit design; interference suppression; 0.25 micron; 0.6 micron; CSMC process; ESD protection device; ESD robustness; HHNEC process; MEDICI; electrothermal effects coupling; Circuit analysis; Circuit simulation; Circuit testing; Coupling circuits; Delay; Electrostatic discharge; Electrothermal effects; Medical simulation; Protection; Robustness;
Conference_Titel :
Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0160-7
Electronic_ISBN :
1-4244-0161-5
DOI :
10.1109/ICSICT.2006.306160
