DocumentCode
3469735
Title
A novel test module for interconnect diagnosis enhancement and quality improvement in daisy chain test
Author
Chung-Han Huang ; Sen-Kuei Hsu ; Wei-Hsun Lin ; Cheng-Bin Chen ; Hung-Chih Lin ; Ching-Nen Peng ; Min-Jer Wang
Author_Institution
Taiwan Semicond. Manuf. Co., Ltd., Hsinchu, Taiwan
fYear
2013
fDate
6-6 Sept. 2013
Firstpage
1
Lastpage
4
Abstract
A novel test module (NTM) for daisy chain test is proposed. In the daisy chain test, the defected chains and components can be easily observed and repaired rapidly by the proposed technology. Besides, the cost of proposed module is much cheaper than the price of tester improvement. Finally, the measured results of the test with NTM are also proposed for verification. The proposed module can save not only debugging time but also the cost in the daisy chain test.
Keywords
integrated circuit interconnections; integrated circuit measurement; integrated circuit testing; modules; three-dimensional integrated circuits; 3DIC; NTM; daisy chain test; interconnect diagnosis enhancement; novel test module; quality improvement; three-dimensional integrated circuit; Connectors; Joints; Logic gates; Substrates; FPGA; and novel test module; daisy chain; programmable;
fLanguage
English
Publisher
ieee
Conference_Titel
e-Manufacturing & Design Collaboration Symposium (eMDC), 2013
Conference_Location
Hsinchu
Type
conf
DOI
10.1109/eMDC.2013.6756045
Filename
6756045
Link To Document