Title :
A novel test module for interconnect diagnosis enhancement and quality improvement in daisy chain test
Author :
Chung-Han Huang ; Sen-Kuei Hsu ; Wei-Hsun Lin ; Cheng-Bin Chen ; Hung-Chih Lin ; Ching-Nen Peng ; Min-Jer Wang
Author_Institution :
Taiwan Semicond. Manuf. Co., Ltd., Hsinchu, Taiwan
Abstract :
A novel test module (NTM) for daisy chain test is proposed. In the daisy chain test, the defected chains and components can be easily observed and repaired rapidly by the proposed technology. Besides, the cost of proposed module is much cheaper than the price of tester improvement. Finally, the measured results of the test with NTM are also proposed for verification. The proposed module can save not only debugging time but also the cost in the daisy chain test.
Keywords :
integrated circuit interconnections; integrated circuit measurement; integrated circuit testing; modules; three-dimensional integrated circuits; 3DIC; NTM; daisy chain test; interconnect diagnosis enhancement; novel test module; quality improvement; three-dimensional integrated circuit; Connectors; Joints; Logic gates; Substrates; FPGA; and novel test module; daisy chain; programmable;
Conference_Titel :
e-Manufacturing & Design Collaboration Symposium (eMDC), 2013
Conference_Location :
Hsinchu
DOI :
10.1109/eMDC.2013.6756045
