DocumentCode
3469980
Title
First-principles evaluations of dielectric properties from nano-scale points of view
Author
Nakamura, Jun ; Wakui, Sadakazu ; Natori, Akiko
Author_Institution
Dept. of Electron. Eng., Univ. of Electro-Commun., Tokyo
fYear
2006
fDate
23-26 Oct. 2006
Firstpage
1407
Lastpage
1410
Abstract
Dielectric properties of ultra-thin Si(111), SiO2, and La2O3(0001) films have been investigated using two methods, internal field method and dipole moment method, on the basis of the first-principles ground-states calculations in external electrostatic fields. With increasing thickness of the Si(111) film, the optical dielectric constant evaluated at the center of the slab converges to the experimental bulk dielectric constant, while the energy gap of the slabs is still larger than that of corresponding bulk. On the other hand, both the optical and the static dielectric constants of beta-SiO2(0001) films hardly depend on the film thickness and the spatial variation of the local dielectric constant is also very small. It has been found that both the surface effect and the quantum confinement effect are small on ultra-thin beta-SiO2(0001) films. Further, it has been revealed that ultra-thin La2O3(0001) film having a thickness of 1.1 nm possesses a large value of the static dielectric constant (29.2) equivalent to that of bulk
Keywords
dielectric polarisation; dielectric thin films; energy gap; ground states; method of moments; permittivity; 1.1 nm; La2O3; La2O3(0001) films; Si; Si(111) film; SiO2; dielectric properties; dipole moment method; energy gap; external electrostatic fields; first-principles ground-states calculations; internal field method; optical dielectric constant; quantum confinement effect; static dielectric constants; surface effect; ultra-thin films; Delta modulation; Density functional theory; Dielectric constant; Nanostructures; Optical films; Optical surface waves; Polarization; Potential well; Semiconductor films; Slabs;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
Conference_Location
Shanghai
Print_ISBN
1-4244-0160-7
Electronic_ISBN
1-4244-0161-5
Type
conf
DOI
10.1109/ICSICT.2006.306198
Filename
4098424
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