Title :
Design tools for 3D mixed mode placement
Author :
Li, Zhuoyuan ; Yan, Haixia ; Hong, Xianlong ; Zhou, Qiang ; Bian, Jinian ; Yang, Hannah H. ; Pitchumani, Vijay
Author_Institution :
Dept. of Comput. Sci. & Technol., Tsinghua Univ., Beijing
Abstract :
We present a set of design tools for three dimensional (3D) mixed mode placement (MMP). The hierarchical 3D MMP design tool is composed of a hierarchical clustering package, a new 3D floorplanning tool, route planning tool, and 2D global/detailed placement tools. We have analyzed the performance of 3D circuit using these tools. It is shown that total wirelength could be reduced by 25% to 43% compared with traditional 2D design using two to four stacked dies. By incorporating thermal management and analysis, we also investigate the thermal scalability of 3D integration
Keywords :
integrated circuit layout; logic design; mixed analogue-digital integrated circuits; thermal analysis; thermal management (packaging); 2D global/detailed placement tools; 3D MMP design tool; 3D circuit; 3D floorplanning tool; 3D integration; 3D mixed mode placement; hierarchical clustering package; route planning tool; stacked dies; thermal analysis; thermal management; Circuits; Clustering algorithms; Complexity theory; Computer science; Graphical user interfaces; Nonhomogeneous media; Packaging; Routing; Temperature; Thermal management;
Conference_Titel :
ASIC, 2005. ASICON 2005. 6th International Conference On
Conference_Location :
Shanghai
Print_ISBN :
0-7803-9210-8
DOI :
10.1109/ICASIC.2005.1611447
