Inspection flow of yield impacting systematic defects

Author

Chimin Chen ; ChengHua Yang ; Hsiang-Chou Liao ; Tuung Luoh ; Ling-Wu Yang ; Tahone Yang ; Kuang-Chao Chen ; Chih-Yuan Lu ; Donghua Liu ; Fan, Jintao ; Rong Lv

Author_Institution

Technol. Dev. Center, Macronix Int. Co. Ltd., Hsinchu, Taiwan

fYear

2013

fDate

6-6 Sept. 2013

Firstpage

1

Lastpage

3

Abstract

Yield impacting systematic defects finding is no longer just relied on Design Rule Checking (DRC) provided by designer or Lithography Rule Checking (LRC) provided by post-optical proximity correction (OPC) results. An inspection flow is proposed in this paper, which is combining the inspection KLA tool and Hotspot Pattern Analyzer (HPA) database software to do the systematic defects filtering, sorting, grouping, and classification on the data base after hot scan inspection. 2^nd time high sensitive inspection is done with new care area, which is reduced into one ten-thousandth of original inspection area. Following this inspection flow, we can identify the process window more accuracy.

Keywords

inspection; lithography; materials handling; production engineering computing; semiconductor technology; HPA database software; KLA tool; design rule checking; hotspot pattern analyzer; inspection flow; lithography rule checking; post optical proximity correction; systematic defect classification; systematic defect filtering; systematic defect grouping; systematic defect sorting; Finite element analysis; Joints; Lead; Systematics; FEM; Hot Scan; PWQ; Pattern Grouping; Systematic Defect;

fLanguage

English

Publisher

ieee

Conference_Titel

e-Manufacturing & Design Collaboration Symposium (eMDC), 2013

Conference_Location

Hsinchu

Type

conf

DOI

10.1109/eMDC.2013.6756065

Filename

6756065