• DocumentCode
    3470137
  • Title

    Development of fingertip tactile sensing chips for humanoid robots

  • Author

    Dahiya, Ravinder S. ; Metta, G. ; Valle, M.

  • Author_Institution
    Brain & Cognitive Sci. Dept., Italian Inst. of Technol., Genoa
  • fYear
    2009
  • fDate
    14-17 April 2009
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    This paper presents the development of tactile sensing chips, for the fingertips of humanoid robots. In the first phase of development, piezoelectric polymer-MEA (microelectrode array) based test chips have been realized. Each chip comprises of 32 microelectrodes, epoxy-adhered with a thin piezoelectric polymer (PVDF-TrFE) film. The diameter of each microelectrode or dasiataxelpsila (tactile element) is 500 mum and the center to center distance between taxels is 1 mm. The tactile sensing chips have been experimentally evaluated over a wide range (0.02 - 4N or ~ 2 gmf- 400 gmf) of dynamic normal forces and frequencies (2 Hz - 5 KHz) by applying variable force with constant frequency in the first case and constant force with variable frequency in latter. The cross-talk, among adjacent taxels on the chips, is found to be approximately 20%. Finally, the ability of the chips to identify object material on the basis of their hardness is also demonstrated.
  • Keywords
    humanoid robots; microelectrodes; microprocessor chips; piezoelectric devices; polymers; tactile sensors; touch (physiological); fingertip tactile sensing chip; humanoid robot; microelectrode array; piezoelectric polymer; tactile sensor; Communication system control; Ethernet networks; Haptic interfaces; Hardware; Humanoid robots; Humans; Mechatronics; Testing; Universal Serial Bus; Virtual environment; MEA; Tactile Sensing; Tactile Sensing Arrays;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mechatronics, 2009. ICM 2009. IEEE International Conference on
  • Conference_Location
    Malaga
  • Print_ISBN
    978-1-4244-4194-5
  • Electronic_ISBN
    978-1-4244-4195-2
  • Type

    conf

  • DOI
    10.1109/ICMECH.2009.4957166
  • Filename
    4957166