DocumentCode
3470272
Title
Warpage behavior in 2.5D package using Si-interposer
Author
Hara, Kentaro ; Murayama, Kei ; Aizawa, Mitsuhiro ; Higashi, Masatake
Author_Institution
R&D Div., Product Planning & Dev. Dept. I, Shinko Electr. Ind. Co., Ltd., Nagano, Japan
fYear
2013
fDate
11-13 Nov. 2013
Firstpage
1
Lastpage
4
Abstract
Influence factors of warpage change during assembly process for 2.5D package using silicon-interposer were investigated. Mechanical properties of organic substrate have the dominant influence. In contrast, material properties of U.F. material have little impact.
Keywords
assembling; elemental semiconductors; integrated circuit packaging; mechanical properties; silicon; 2.5D package; Si; Si-interposer; assembly process; mechanical properties; organic substrate; warpage behavior; Assembly; Strain; Stress; Substrates; Three-dimensional displays; Vehicles; Si-interposer; warpage change;
fLanguage
English
Publisher
ieee
Conference_Titel
CPMT Symposium Japan (ICSJ), 2013 IEEE 3rd
Conference_Location
Kyoto
Print_ISBN
978-1-4799-2718-0
Type
conf
DOI
10.1109/ICSJ.2013.6756076
Filename
6756076
Link To Document