Title :
Warpage behavior in 2.5D package using Si-interposer
Author :
Hara, Kentaro ; Murayama, Kei ; Aizawa, Mitsuhiro ; Higashi, Masatake
Author_Institution :
R&D Div., Product Planning & Dev. Dept. I, Shinko Electr. Ind. Co., Ltd., Nagano, Japan
Abstract :
Influence factors of warpage change during assembly process for 2.5D package using silicon-interposer were investigated. Mechanical properties of organic substrate have the dominant influence. In contrast, material properties of U.F. material have little impact.
Keywords :
assembling; elemental semiconductors; integrated circuit packaging; mechanical properties; silicon; 2.5D package; Si; Si-interposer; assembly process; mechanical properties; organic substrate; warpage behavior; Assembly; Strain; Stress; Substrates; Three-dimensional displays; Vehicles; Si-interposer; warpage change;
Conference_Titel :
CPMT Symposium Japan (ICSJ), 2013 IEEE 3rd
Conference_Location :
Kyoto
Print_ISBN :
978-1-4799-2718-0
DOI :
10.1109/ICSJ.2013.6756076
