• DocumentCode
    3470361
  • Title

    SWEAT structure design and test procedure criteria based upon TEARS characterization and spatial distribution of failures in iterated structures

  • Author

    Crowell, Clarence R. ; Shih, Chih-Ching ; Tyree, Vance C.

  • Author_Institution
    Univ. of Southern California, Los Angeles, CA, USA
  • fYear
    1991
  • fDate
    9-11 April 1991
  • Firstpage
    277
  • Lastpage
    286
  • Abstract
    The authors consider the prime issues that should be raised when one considers the design of a test system and the procedure to be involved in the test. An extended TEARS (Thermal Energy Accounts for the Resistance of the System) analysis yields end-to-end temperature profiles of an N-fold iterated SWEAT (Standard Wafer-level Electromigration Acceleration Test) structure. The results give guidelines for the choice of voltage probe locations and current injection line lengths and also permit relating measurements on SWEAT structures with different numbers of elemental units and different geometry. Asymmetries in the first and last units correlate with the observed spatial distribution of failures. Criteria for much more rapid convergence and more accurate control of sample stress are presented.<>
  • Keywords
    circuit reliability; electromigration; failure analysis; integrated circuit testing; metallisation; quality control; SWEAT structure design; TEARS characterization; current injection line lengths; electromigration acceleration test; failures; iterated structures; sample stress control; spatial distribution; temperature profiles; test procedure criteria; test system design; voltage probe locations; Current measurement; Electrical resistance measurement; Electromigration; Guidelines; Life estimation; Probes; System testing; Temperature; Thermal resistance; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1991, 29th Annual Proceedings., International
  • Conference_Location
    Las Vegas, NV, USA
  • Print_ISBN
    0-87942-680-2
  • Type

    conf

  • DOI
    10.1109/RELPHY.1991.146028
  • Filename
    146028