• DocumentCode
    3470373
  • Title

    A 12 b 50 M sample/s cascaded folding and interpolating ADC

  • Author

    Vorenkamp, P. ; Roovers, R.

  • Author_Institution
    Philips Composants et Semiconducteurs, Caen, France
  • fYear
    1997
  • fDate
    8-8 Feb. 1997
  • Firstpage
    134
  • Lastpage
    135
  • Abstract
    The architecture of this 12 b ADC is based on a three-stage conversion, using cascaded folding and interpolating techniques. Compared to other multi-stage ADC architectures, folding and interpolating ADCs are based on non-linear analog pre-processing. This architecture is an attractive solution for high-resolution ADCs, as extremely linear circuit topologies are not required. To increase the resolution of folding and interpolating ADCs above the published 8 b examples, without raising the number of parallel input stages or the number of comparators in the fine-comparator, a cascaded folding and interpolating architecture is introduced. The ADC achieves 64 dB signal-to-noise ratio (SNR) and 75 dB spurious-free dynamic range (SFDR), while quantizing a 15 MHz full-scale input signal at 50 MSample/s. The 7.0 mm/sup 2/ ADC is fabricated in a 13 GHz, 1 /spl mu/m BiCMOS process and dissipates 300 mW from a single 5.0 V supply. The device is mounted in a standard 44-pin plastic package.
  • Keywords
    cascade networks; 12 bit; BiCMOS IC; cascaded folding interpolating architecture; high-resolution ADC; linear circuit topology; multi-stage architecture; nonlinear analog preprocessing; signal quantization; signal-to-noise ratio; spurious-free dynamic range; three-stage conversion; BiCMOS integrated circuits; Circuit topology; Dynamic range; Error correction; Feedforward systems; Linear circuits; Plastic packaging; Semiconductor device noise; Signal resolution; Signal to noise ratio;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference, 1997. Digest of Technical Papers. 43rd ISSCC., 1997 IEEE International
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    0193-6530
  • Print_ISBN
    0-7803-3721-2
  • Type

    conf

  • DOI
    10.1109/ISSCC.1997.585303
  • Filename
    585303