DocumentCode
3470458
Title
A Wafer-level pressure calibration method for integrated accelerometer and pressure sensor in TPMS application
Author
Yangxi Zhang ; Fanrui Meng ; Guandong Liu ; Chengchen Gao ; Yilong Hao
Author_Institution
Inst. of Microelectron., Peking Univ., Beijing, China
fYear
2015
fDate
21-25 June 2015
Firstpage
2164
Lastpage
2167
Abstract
The tire pressure monitoring system (TPMS) normally contains an accelerometer. For piezoresistive accelerometers, low cost wafer-level full-range calibration is still a challenge. A novel wafer-lever pressure calibration method for accelerometer is reported in this paper. This method can be applied on a beam-block-membrane structure accelerometer which is sensitive to both acceleration and pressure. By measuring accelerometer´s full-range response in a static pressure test step, the method can significantly reduce testing cost and workload in TPMS sensor production. Integrated pressure sensor can also be tested in this pressure test step. Simulation results show the feasibility to calculate the accelerometer´s response from pressure test results. An integrated sensor (100g+500kPa measure range) for TPMS application was fabricated and measured through pressure test.
Keywords
accelerometers; calibration; pressure sensors; wafer level packaging; Integrated pressure sensor; beam-block-membrane structure accelerometer; integrated accelerometer; tire pressure monitoring system; wafer-level pressure calibration method; Acceleration; Accelerometers; Calibration; Micromechanical devices; Piezoresistance; Pressure sensors; Sensitivity; Piezoresistive Accelerometer; Pressure Calibration; Tire Pressure Monitoring System; Wafer Level;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers - 2015 18th International Conference on
Conference_Location
Anchorage, AK
Type
conf
DOI
10.1109/TRANSDUCERS.2015.7181388
Filename
7181388
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