Title :
Hybrid integration technology of laser source with laser diode arrays on silicon optical waveguide platform by flip-chip bonding for silicon photonics
Author :
Shimizu, Tsuyoshi ; Hatori, Nobuaki ; Ishizaka, Masashige ; Urino, Yutaka ; Yamamoto, Takayuki ; Nakamura, T. ; Okano, Makoto ; Mori, Marco ; Arakawa, Yasuhiko
Author_Institution :
Inst. for Photonics-Electron. Convergence Syst. Technol. (PECST), Photonics-Electron. Technol. Res. Assoc. (PETRA), Tsukuba, Japan
Abstract :
Hybrid integration technology of a laser source on a silicon optical waveguide platform by flip-chip bonding for silicon photonics has been developed. Several types of integrated laser sources were demonstrated, including multi-channel, high-density and high temperature operation.
Keywords :
elemental semiconductors; flip-chip devices; hybrid integrated circuits; integrated optics; integrated optoelectronics; optical waveguides; semiconductor laser arrays; silicon; Si; flip-chip bonding; hybrid integration technology; laser diode arrays; laser source; multichannel high-density high temperature operation; optical waveguide; silicon photonics; Integrated optics; Light sources; Optical device fabrication; Optical transmitters; Optical waveguides; Silicon; Waveguide lasers; flip-chip bonding; hybrid integration; silicon photonics;
Conference_Titel :
CPMT Symposium Japan (ICSJ), 2013 IEEE 3rd
Conference_Location :
Kyoto
Print_ISBN :
978-1-4799-2718-0
DOI :
10.1109/ICSJ.2013.6756091
