Thermal via technology for silica-based planar lightwave circuit

Author

Aozasa, S. ; Kurata, Yu ; Hashizume, Yasuaki ; Itoh, M. ; Fukuyama, Hidenao

Author_Institution

NTT Photonics Labs., NTT Corp., Atsugi, Japan

fYear

2013

fDate

11-13 Nov. 2013

Firstpage

1

Lastpage

4

Abstract

We propose the first thermal via technology for a silica-based planar lightwave circuit (PLC) to enable us to stack electronic components such as transimpedance amplifiers (TIAs) on a PLC. This is possible because the effective heat dissipation of the via can prevent the performance degradation of the TIA. The temperature increase of the TIAs was suppressed to only 8.7°C by the thermal vias, while it was 15.7°C without them. Silica-based PLCs with thermal vias will be a key technology for compact high performance PLC devices.

Keywords

cooling; integrated optics; integrated optoelectronics; operational amplifiers; silicon compounds; PLC; SiO₂; TIA; effective heat dissipation; silica-based planar lightwave circuit; stack electronic components; temperature 15.7 degC; temperature 8.7 degC; thermal via technology; transimpedance amplifiers; Conductivity; Glass; Heating; Microassembly; Optical devices; Silicon; Thermal conductivity; TIA; silica-based planar lightwave circuit; stack integration; thermal via;

fLanguage

English

Publisher

ieee

Conference_Titel

CPMT Symposium Japan (ICSJ), 2013 IEEE 3rd

Conference_Location

Kyoto

Print_ISBN

978-1-4799-2718-0

Type

conf

DOI

10.1109/ICSJ.2013.6756092

Filename

6756092