Title :
Power/ground wiring for high speed driver: Evaluating method by comparison with actual and simulation schemes
Author :
Hashimoto, Koji ; Akiyama, Yoko ; Ueda, Chihiro ; Ito, Takao ; Otsuka, Kanji
Author_Institution :
Collaborative Res. Center, Meisei Univ., Hino, Japan
Abstract :
In our previous studies [1], [2], good power supply wirings on a chip have provided excellent high-speed switching and tinny power swing fluctuation. In this study, we again confirmed this by higher precision re-measurements correlated with simulations. If the power integrity (PI) would be better on the circuit, the circuit would be expected that the CMOS driver makes it sure to take higher-speed switching. Such kind of scheme had not been tried previously, because the power line performance expression by SPICE tool had to be difficult to coincident with actual power line. We planed to build the power supply circuit model by SPICE tool reflected faithfully with the test coupon. As the simulation model from the transmission line for the power line is coincided with actual physical structure, we can make the concept how to design and produce circuits from the variation of simulation results. Then we can get the key design rule for over Gbps region on a input/output (I/O) interface circuit system.
Keywords :
driver circuits; switched mode power supplies; transmission lines; wiring; I-O interface circuit system; PI; SPICE tool; high speed CMOS driver; high-speed switching fluctuation; input-output interface circuit system; power integrity; power supply wiring circuit; power-ground wiring; tinny power swing fluctuation; transmission power line performance; CMOS integrated circuits; Electrostatic discharges; Integrated circuit modeling; MOS devices; Semiconductor device measurement; Transistors; Wiring; high-speed switching by PI; input impedance for power supply; power integrity; power integrity(PI) for 10 Gbps region;
Conference_Titel :
CPMT Symposium Japan (ICSJ), 2013 IEEE 3rd
Conference_Location :
Kyoto
Print_ISBN :
978-1-4799-2718-0
DOI :
10.1109/ICSJ.2013.6756113