• DocumentCode
    3471293
  • Title

    Development of high-speed X-ray CT inspection system using X-ray line sensor

  • Author

    Suzuki, Daisuke ; Noguchi, Keisuke ; Murakoshi, Takayuki ; Teramoto, A.

  • Author_Institution
    Eng. Dept., Nagoya Electr. Works Co., Ltd., Ama, Japan
  • fYear
    2013
  • fDate
    11-13 Nov. 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The recent progress in surface mount technology has highlighted an urgent demand for a higher performance level of inspection technology. X-ray inspection is one of the most suitable systems for substituting the conventional automated optical inspection system. In particular, X-ray computed tomography (CT) inspection provides precise inspection as it can obtain three-dimensional data and can distinguish the features on the top side of a double-sided printed circuit board (PCB) from those on the bottom side. However, X-ray inspection systems are not in common use in the surface mount production line due to their complex image capturing mechanism, which requires a longer inspection time. Taking this limitation into consideration, we developed a simple mechanism utilizing an X-ray line sensor to obtain CT images of a wide area at a faster rate. We term this system as linear CT. In this paper, we explain the image capturing mechanism of linear CT and report that this mechanism can generate cross-sectional images of sufficiently high quality for precise inspection.
  • Keywords
    X-ray microscopy; computerised tomography; inspection; surface mount technology; X-ray computed tomography inspection; X-ray line sensor; cross-sectional images; high-speed X-ray CT inspection system; image capturing mechanism; linear computed tomography; precise inspection; surface mount technology; Computed tomography; Detectors; Electronics packaging; Inspection; Optical imaging; Soldering; X-ray imaging; X-ray; computed tomography (CT); inspection system; linear CT;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    CPMT Symposium Japan (ICSJ), 2013 IEEE 3rd
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-1-4799-2718-0
  • Type

    conf

  • DOI
    10.1109/ICSJ.2013.6756131
  • Filename
    6756131